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Huaswin Electronics Co.,Limited
Huaswin Electronics Co.,Limited Rigid PCB, Flexible PCB, Rigid Flex PCB, PCB Assembly, SMT / Through hole Assembly, custom cable assembly manufacturer in China
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Blue Solder mask PCB Assembly Game Circuit Board Assembly SMT / DIP Assembly

Huaswin Electronics Co.,Limited
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Huaswin Electronics Co.,Limited
Country/Region: China
Tel: 86-0755-2907-7956
Contact Person:
Ms Vicky Lee

Blue Solder mask PCB Assembly Game Circuit Board Assembly SMT / DIP Assembly

Brand Name : HUASWIN
Model Number : HSPCBA1074
Certification : ISO/UL/RoHS
Place of Origin : China
MOQ : 1 sets
Price : Negotiation
Payment Terms : T/T, Western Union, L/C
Supply Ability : 10,000pcs per month
Delivery Time : 15-20 working days
Packaging Details : Anti-static bag + Anti-static bubble wrap + Good quality carton box
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Blue Solder mask PCB Assembly Game Circuit Board Assembly SMT / DIP Assembly

PCBA boards for game equipment


Specifications

1. PCB Assembly on SMT and DIP

2. PCB schematic drawing/ layout /producing

3. PCBA clone/change board

4. Components sourcing and purchasing for PCBA

5. Enclosure design and plastic injection molding

6. Testing services. Including: AOI, Fuction Testing , In Circuit Testing, X-Ray For BGA Testing, 3D Paste Thickness Test

7. IC programing


Quotation Requirement :


Following specifications are needed for quotation:
1) Base material:
2) Board thickness:
3) Copper thickness:
4) Surface treatment:
5) Color of solder mask and silkscreen:
6) Quantity
7) Gerber file &BOM

Huaswin specialized in PCB manufacturing and and PCB Assembly


PCBA capabilities:

Fast prototyping
High mix, low and medium volume build
SMT MinChip:0201
BGA: 1.0 to 3.0 mm pitch
Through-hole assembly
Special processes (such as conformal coating and potting)
ROHS capability
IPC-A-610E and IPC/EIA-STD workmanship operation


Detailed Specification of PCB Manufacturing

1

layer

1-30 layer

2

Material

CEM-1, CEM-3 FR-4, FR-4 High TG,
Polyimide,
Aluminum-based
material.

3

Board thickness

0.2mm-6mm

4

Max.finished board size

800*508mm

5

Min.drilled hole size

0.25mm

6

min.line width

0.075mm(3mil)

7

min.line spacing

0.075mm(3mil)

8

Surface finish

HAL, HAL Lead free,Immersion Gold/
Silver/Tin,
Hard Gold, OSP

9

Copper thickness

0.5-4.0oz

10

Solder mask color

green/black/white/red/blue/yellow

11

Inner packing

Vacuum packing,Plastic bag

12

Outer packing

standard carton packing

13

Hole tolerance

PTH:±0.076,NTPH:±0.05

14

Certificate

UL,ISO9001,ISO14001,ROHS,TS16949

15

Profiling punching

Routing,V-CUT,Beveling


PCB Assembly services:

SMT Assembly


Automatic Pick & Place
Component Placement as Small as 0201
Fine Pitch QEP - BGA
Automatic Optical Inspection

Through-hole Assembly


Wave Soldering
Hand Assembly and Soldering
Material Sourcing
IC pre-programming / Burning on-line
Function testing as requested
Aging test for LED and Power boards
Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc)
Packing design


Conformal coating


Both dip-coating and vertical spray coating is available. Protecting non-conductive dielectric layer that is
applied onto the printed circuit board assembly to protect the electronic assembly from damage due to
contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments.
When coated, it is clearly visible as a clear and shiny material.


Complete box build


Complete 'Box Build' solutions including materials management of all components, electromechanical parts,
plastics, casings and print & packaging material


Testing Methods


AOI Testing
Checks for solder paste
Checks for components down to 0201"
Checks for missing components, offset, incorrect parts, polarity
X-Ray Inspection
X-Ray provides high-resolution inspection of:
BGAs
Bare boards


In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by
component problems.

Power-up Test
Advanced Function Test
Flash Device Programming
Functional testing


Quality Processes:


1. IQC: Incoming Quality Control (Incoming Materials Inspection)
2. First Article Inspection (FAI) for every process
3. IPQC: In Process Quality Control
4. QC: 100% Test & Inspection
5. QA: Quality Assurance based on QC inspection again
6. Workmanship: IPC-A-610, ESD
7. Quality Management based on CQC, ISO9001:2008, ISO/TS16949



China Customized Inflatable Bumper Ball Game Bubble Adult Grass CE supplier

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