0.2mm Thick Rigid PCB PCBA Board High Speed SMT Assembly Services
- Layer: 1-30 layer
- Material:CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based
- Board thickness:0.2mm-6mm
- min.line width:0.075mm(3mil)
- min.line spacing:0.075mm(3mil)
- Surface finish:HAL, HAL Lead free,Immersion Gold/ Silver/Tin,Hard
- PCB/PCB Assembly manufacturing :OEM/ODM service
Detailed Specification of PCB Manufacturing
CEM-1, CEM-3 FR-4, FR-4 High TG,
Max.finished board size
Min.drilled hole size
HAL, HAL Lead free,Immersion Gold/
Hard Gold, OSP
Solder mask color
Vacuum packing,Plastic bag
standard carton packing
Detailed Specification of Pcb Assembly
Type of Assembly
SMT and Thru-hole
Water Soluble Solder Paste,Leaded and Lead-Free
Passives Down to 0201 Size
BGA and VFBGA
Leadless Chip Carries/CSP
Double-Sided SMT Assembly
Fine Pitch to 08 Mils
BGA Repair and Reball
Part Removal and Replacement-Same Day Service
Bare Board Size
Bill of Materials
Type of Service
Turn-Key,Partial Turn-Key or Consignment
15 to 20 days
Welcome to Huaswin!
Huaswin Electronics is a professional PCB & PCB Assembly
manufacturer, located in Shenzhen, China.
We supply one-stop facility services: PCB design, PCB fabrication,
components procurement, SMT and DIP
assembly ,IC pre-programming / burning on-line, testing, packing.
PCB capability and services:
1. Single-sided, double-sided & multi-layer PCB (up to 30
2. Flexible PCB (up to 10 layers)
3. Rigid-flex PCB (up to 8 layers)
4. CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based
5. HAL, HAL lead free, Immersion Gold/ Silver/Tin, Hard Gold, OSP
6. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610
Class 2 international PCB standard.
7. Quantities range from prototype to volume production.
8. 100% E-Test
PCB Assembly services:
Automatic Pick & Place
Component Placement as Small as 0201
Fine Pitch QEP - BGA
Automatic Optical Inspection
Hand Assembly and Soldering
IC pre-programming / Burning on-line
Function testing as requested
Aging test for LED and Power boards
Complete unit assembly (which including plastics, metal box, Coil,
cable assembly etc)
Both dip-coating and vertical spray coating is available.
Protecting non-conductive dielectric layer that is
applied onto the printed circuit board assembly to protect the
electronic assembly from damage due to
contamination, salt spray, moisture, fungus, dust and corrosion
caused by harsh or extreme environments.
When coated, it is clearly visible as a clear and shiny material.
Complete box build
Complete 'Box Build' solutions including materials management of
all components, electromechanical parts,
plastics, casings and print & packaging material
·Checks for solder paste
·Checks for components down to 0201"
·Checks for missing components, offset, incorrect parts, polarity
X-Ray provides high-resolution inspection of:
In-Circuit Testing is commonly used in conjunction with AOI
minimizing functional defects caused by
· Power-up Test
· Advanced Function Test
· Flash Device Programming
· Functional testing
Huaswin’s production facility is ISO9001 certified to ensure top
quality production of your product!